The fifth annual REPP symposium will take place at the Silicon Valley of the Midwest, Purdue University. It will focus on quantified reliability, accelerated testing and probabilistic assessments of the useful lifetime of electronic, photonic, MEMS and MOEMS materials, assemblies, packages and systems in electronics and photonics packaging. This includes failure modes, mechanisms, testing schemes, accelerated testing, stress levels, and environmental stresses. The intent is to bring together electrical, reliability, materials, mechanical, and computer engineers and applied scientists to address the state‐of‐the‐art in all the interconnected fields of electronic and photonic packaging, with an emphasis on various reliability‐ related aspects: design‐for‐reliability, manufacturing, reliability modeling and accelerated testing.

Event Format : Hybrid (In-person and Virtual)